IOT LOGGER

IOT Logger Case
Client: Smart Building Services
Product Category: Industrial
Production Process(s): Injection Moulding & Sheet Metal Fabrication
Material(s): GF Nylon & Aluminium

Project Details:

Our team designed and developed an IoT logger enclosure for Smart Building Services, creating a robust and manufacturable housing solution for a connected monitoring device used within building management applications. The project focused on seamlessly integrating electronic components into a purpose-designed enclosure while ensuring the product was optimised for high-volume production.

The development process began with the creation of a range of design concepts that explored different approaches to packaging, installation, and user interaction. Working closely with Smart Building Services and a local electronics development consultancy, we collaborated throughout the project to ensure the mechanical and electronic systems were fully integrated and aligned with the product requirements.

A key aspect of the project was the integration of the electronic PCB assemblies and associated components within a compact and durable enclosure. Careful consideration was given to component placement, mounting features, cable management, ventilation requirements, and assembly processes to ensure reliable performance and ease of manufacture. The enclosure was designed using glass-filled nylon and aluminium components, providing a balance of strength, durability, and long-term performance in commercial building environments.

Following concept selection, we developed the preferred design into a fully detailed production-ready solution. The enclosure components were engineered for injection moulding and sheet metal fabrication, with attention given to manufacturability, assembly efficiency, and cost-effective high-volume production. Detailed engineering documentation was produced to support tooling, manufacturing, and product rollout.

The result is a durable, professional-grade IoT logger enclosure that successfully integrates complex electronic systems within a compact and manufacturable package. The final design provides reliable protection for the device electronics while supporting scalable production and deployment across a wide range of smart building applications.